spi2016.org
SPI 2016
http://www.spi2016.org/home.asp
Best Student Paper Award Sponsor. SPI2017 will be in Italy again! Location will be announced shortly. The final program is online. Turin has been selected by NYTimes as the only italian destination. In the 52 top places to visit in 2016! Check it out here. Scroll down to position 31). On this web site you can find all information regarding the 20th IEEE Workshop on Signal and Power Integrity. It is our pleasure to invite you to the conference and we look forward to meeting you in Turin!
spi2016.org
SPI 2016
http://www.spi2016.org/program.asp
Best Student Paper Award Sponsor. Instructions for presenters (oral and poster). SUN, May 8. MON, May 9. TUE, May 10. WED, May 11. Click on each day to view the corresponding program. You can download a PDF version of the final program here. Last updated: October 13, 2015. Submit questions/comments to: spi2016@seleneweb.com.
spi2016.org
SPI 2016
http://www.spi2016.org/submission.asp
Best Student Paper Award Sponsor. Paper submission is closed. Prospective Authors are invited to submit:. A two- to four-page camera-ready manuscript. Formatted according to the official IEEE template. For conference proceedings (available for LaTeX and Microsoft Word software). Only PDF files are accepted. Download the customized SPI2016 form here. Or a blank form from IEEE. BEST STUDENT PAPER AWARD CONTEST. Papers authored by students are eligible for the SPI Best Student Paper Award. Submit questions/...
signalkhobho.com
無題ドキュメント
http://www.signalkhobho.com/link.html
spi2016.org
SPI 2016
http://www.spi2016.org/cfp.asp
Best Student Paper Award Sponsor. Paper submission is closed. A PDF version of this SPI2016 call for papers can be downloaded here. The Technical Program Committee (TPC) is seeking original and unpublished contributions on all aspects of Signal and Power Integrity. Detailed instructions for manuscript submission are available here. All contributions will be subjected to a rigorous review process, conducted by the TPC. Modeling and simulation for SI/PI. Coupled Signal and Power Integrity analysis. Advance...
spi2016.org
SPI 2016
http://www.spi2016.org/committee.asp
Best Student Paper Award Sponsor. Politecnico di Torino, Torino (ITA). Igor S. Stievano. Politecnico di Torino, Torino (ITA). Ghent University, Gent (BEL). Physikalisch-Technische Bundesanstalt, Braunschweig (GER). Flavio G. Canavero. Politecnico di Torino, Torino (ITA). Leibniz University Hannover, Hannover (GER). University of Cassino and Southern Lazio, Cassino (ITA). Michel S. Nakhla. Carleton University, Ottawa (CAN). José E. Schutt-Ainé. University of Illinois, Urbana-Champaign (USA). M Telescu, Un...
spi2016.org
SPI 2016
http://www.spi2016.org/venue.asp
Best Student Paper Award Sponsor. Turin has been selected by NYTimes as the only italian destination. In the 52 top places to visit in 2016! Check it out here. Scroll down to position 31). Take a look at this video. On Turin and its province! Corso Vittorio Emanuele II, 54. And the Egyptian Museum. Of a few landmarks. Crowned by the majestic Alps, the town is remarkable for the harmony of its various architectural styles and the excellence of its museums! From Baroque to Art Nouveau and Modernism, Torino...
spi2016.org
SPI 2016
http://www.spi2016.org/exhibition.asp
Best Student Paper Award Sponsor. Several sponsorship opportunities with attractive benefits are available ( Platinum. Each level of sponsorship provides a different level of company exposure and marketing opportunities, including. Booth space during the conference. Complimentary full registrations for the conference. Possibility to include brochures and gadgets in conference bags. Company logo on conference web site and conference materials. Dedicated space in the front matter of conference proceedings.
epeps.org
Conference on Electrical Performance of Electronic Packaging and Systems 2015
http://www.epeps.org/tpc.html
Technical Program Committee (TPC):. Peter H. Aaen,. University of Surrey, UK. North Carolina State University. Indian Institute of Science. University of Hong Kong. Emeritus IBM; MST. Paper Review Committee (PRC):. University of California at San Diego. San Diego State University. University of Cassino and Southern Lazio. Sung Joo Park,. Georgia Institute of Technology. Dries Vande Ginste,. 2016 Electrical Performance of Electronic Packaging and Systems.
epeps.org
Conference on Electrical Performance of Electronic Packaging and Systems 2015
http://www.epeps.org/submission.html
Authors are invited to submit manuscripts in a PDF format. Double-Column) describing new technical contributions in the areas broadly covered in the Call for Papers. Submitted manuscripts should be camera ready and compliant with the general standards of the IEEE, including appropriate referencing. Noncompliant manuscripts will not be considered for review. TO SUBMIT CLICK HERE. For full call for papers click here: Call for Papers. For IEEE templates, click here. Or choose in Latex. Student Author should...
