packaging.buffalo.edu packaging.buffalo.edu

packaging.buffalo.edu

UB Electronic Packaging Laboratory

The School of Engineering and Applied Sciences. The Electronic Packaging Laboratory is an interdisciplinary research center of the University at Buffalo, The State University of New York. The purpose of this laboratory is to develop the computational and experimental tools needed to develop the next generation of nanoelectronics and nanophotonics devices. Our graduates have been hired by Microsoft, IBM, Analog Devices, Honda Electronics, Tyco Electronics, among many other prestigious companies.

http://packaging.buffalo.edu/

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The School of Engineering and Applied Sciences. The Electronic Packaging Laboratory is an interdisciplinary research center of the University at Buffalo, The State University of New York. The purpose of this laboratory is to develop the computational and experimental tools needed to develop the next generation of nanoelectronics and nanophotonics devices. Our graduates have been hired by Microsoft, IBM, Analog Devices, Honda Electronics, Tyco Electronics, among many other prestigious companies.
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UB Electronic Packaging Laboratory | packaging.buffalo.edu Reviews

https://packaging.buffalo.edu

The School of Engineering and Applied Sciences. The Electronic Packaging Laboratory is an interdisciplinary research center of the University at Buffalo, The State University of New York. The purpose of this laboratory is to develop the computational and experimental tools needed to develop the next generation of nanoelectronics and nanophotonics devices. Our graduates have been hired by Microsoft, IBM, Analog Devices, Honda Electronics, Tyco Electronics, among many other prestigious companies.

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packaging.buffalo.edu packaging.buffalo.edu
1

UB Electronic Packaging Laboratory

http://www.packaging.buffalo.edu/Employment.html

The School of Engineering and Applied Sciences. Research assistantship positions are available in the Electronic Packaging Laboratory for PhD students with Engineering or Physics background. Please contact Prof. Basaran at cjb@buffalo.edu. For further information, please contact Dr. Cemal Basaran (cjb@buffalo.edu. 102 Ketter Hall Buffalo. Phone: 716-645-4375 Fax: 716-645-3733.

2

UB Electronic Packaging Laboratory

http://www.packaging.buffalo.edu/news.html

The School of Engineering and Applied Sciences. Navy eyes graphene nanoribbon for ultimate power control system. UB Reporter, July 20, 2015). UB engineer has traveled a long distance from humble roots. The Buffalo News, March 19, 2014). Buffalo Engineer Spring 2012: Available Now. UB Engineering, Spring, 2012). Cemal Basaran Receives ASME EPPD Excellence in Mechanics Award. UB News, October 24, 2011). Thermal Problem Solutions of Electronic Devices in Chinese. May 25, 2011). Huliq news, March 25, 2009).

3

UB Electronic Packaging Laboratory

http://www.packaging.buffalo.edu/services.html

The School of Engineering and Applied Sciences. Computational Reliability Analysis and Design. Reliability and structural analysis for packages, interconnects, vias, interfaces, devices and substrates. Custom software development for life cycle analysis. Damage and fracture mechanics. Nonlinear Finite Element Analysis. Mode shape/ Modal frequency analysis. Experimental Reliability Analysis and Design. Thermal cycling, and vibration testing under extreme conditions. Lead-Free Solder Material Selection.

4

UB Electronic Packaging Laboratory

http://www.packaging.buffalo.edu/projects.html

The School of Engineering and Applied Sciences. Multi-physics Simulations of Carbon nanotubes. Nanoscale resolution and high sensitivity Phase shifting Moire Interferometry for mechanical. Characterization of nanoelectronics and its packaging. Transport and Microstructure in SnAgCu Solder. Michael S. Sellers. Large Deformation Micromechanics of Particle Filled Acrylies at High Temperatures. Multi-Scale Modeling of Electromigration and Thermomigration in Nanoelectronics. Damage mechanics of Pb/Sn. Reliabi...

5

UB Electronic Packaging Laboratory

http://www.packaging.buffalo.edu/sponsors.html

The School of Engineering and Applied Sciences. For further information, please contact Dr. Cemal Basaran (cjb@buffalo.edu. 102 Ketter Hall Buffalo. Phone: 716-645-4375 Fax: 716-645-3733.

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The School of Engineering and Applied Sciences. The Electronic Packaging Laboratory is an interdisciplinary research center of the University at Buffalo, The State University of New York. The purpose of this laboratory is to develop the computational and experimental tools needed to develop the next generation of nanoelectronics and nanophotonics devices. Our graduates have been hired by Microsoft, IBM, Analog Devices, Honda Electronics, Tyco Electronics, among many other prestigious companies.

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