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Thruchip Communications Main Site

ThruChip Communications has developed a revolutionary approach for. Wireless near-field die-to-die data communication for 3D chip stacking. The ThruChip Interface (TCI) offers our customers a wireless approach for data communications between stacked die. Signals can go through multiple stacked die using near-field inductive coupling by placing small coils on each die. TCI coils are made from standard metal wires, no special semiconductor process is required.

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Thruchip Communications Main Site | thruchip.com Reviews
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ThruChip Communications has developed a revolutionary approach for. Wireless near-field die-to-die data communication for 3D chip stacking. The ThruChip Interface (TCI) offers our customers a wireless approach for data communications between stacked die. Signals can go through multiple stacked die using near-field inductive coupling by placing small coils on each die. TCI coils are made from standard metal wires, no special semiconductor process is required.
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1 Thruchip
2 Dave Ditzel
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5 Tadahiro Kuroda
6 3D stacking
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Thruchip Communications Main Site | thruchip.com Reviews

https://thruchip.com

ThruChip Communications has developed a revolutionary approach for. Wireless near-field die-to-die data communication for 3D chip stacking. The ThruChip Interface (TCI) offers our customers a wireless approach for data communications between stacked die. Signals can go through multiple stacked die using near-field inductive coupling by placing small coils on each die. TCI coils are made from standard metal wires, no special semiconductor process is required.

INTERNAL PAGES

thruchip.com thruchip.com
1

Thruchip Communications Main Site

http://www.thruchip.com/licensing.htm

Yes, you do need a license to use ThuChip technology for 3D chip stacking applications, but don't worry, its simple. The Kuroda Lab at Keio University has spent over a decade pioneering the use of inductive coupling for chip stacking, and the technology is covered by many patents. ThruChip Communications LLC has partnered with Keio University to proliferate this technology and ThruChip can grant a license to the needed patents. For more information, send us an email to info@ThruChip.com.

2

Thruchip Communications Main Site

http://www.thruchip.com/index.htm

ThruChip Communications has developed a revolutionary approach for. Wireless near-field die-to-die data communication for 3D chip stacking. The ThruChip Interface (TCI) offers our customers a wireless approach for data communications between stacked die. Signals can go through multiple stacked die using near-field inductive coupling by placing small coils on each die. TCI coils are made from standard metal wires, no special semiconductor process is required.

3

Thruchip Communications Main Site

http://www.thruchip.com/faqs.htm

Q: How does the ThruChip Interconnect (TCI) compare to Thru Silicon Vias (TSV)? A: We believe that TCI can be significantly lower cost, lower power, and less intrusive to a design than TSV. While there was a lot of initial interest in TSV, we believe the cost has been prohibitive for many applications, and this will create opportunities for TCI type interconnects. TCI can be implemented with standard CMOS processes, ie with no additional cost for differnt wafer processing, as is the case with TSV.

4

Thruchip Communications Main Site

http://www.thruchip.com/about-us.htm

ThruChip Communications LLC was formed in partnership with Keio University in 2007 to facilitate the licensing of many years of research in 3D stacking of silicon chips by Professor Kuroda and his colleagues. Under the leadership of Professor Kuroda, the Kuroda Lab at Keio University has designed and tested many generations of silicon chips pioneering the use of near field wireless using inductive coupling for high-speed and low-power die-to-die communication. David R. Ditzel.

5

Thruchip Communications Main Site

http://www.thruchip.com/news.htm

Jan 2014) Please visit us at ISSCC. On Sunday Feb 9th, Professor Kuroda is giving a tutorial on "3D Integration, Power Delivery, and Contactless Interconnect by Near-Field Coupling". ISSCC Tutorial T3 Feb 9th Sunday. Dec 2013) Thruchip Communications LLC has appointed David R. Ditzel as the company's next chief executive officer. Mr. Ditzel is a co-founder of Thruchip and has over 3 decades of executive leadership.

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ThruChip Communications has developed a revolutionary approach for. Wireless near-field die-to-die data communication for 3D chip stacking. The ThruChip Interface (TCI) offers our customers a wireless approach for data communications between stacked die. Signals can go through multiple stacked die using near-field inductive coupling by placing small coils on each die. TCI coils are made from standard metal wires, no special semiconductor process is required.

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