stress.malab.com
stress-workshop 2010
http://stress.malab.com/sponsors.html
Scope of the Workshop. We wish to thank the following for their contribution to the success of this conference:. Fraunhofer Institute for Nondestructive Testing, Dresden branch, Germany. Fraunhofer Institute for Material and Beam Technology, Dresden, Germany. Innotec21 GmbH, Leipzig, Germany. The sponsorship provided by the following companies is gratefully acknowledged:. Carl Zeiss, Oberkochen, Germany. Bruker AXS, Karlsruhe, Germany. AXO, Dresden, Germany. Scope of the Workshop.
stress3d.malab.com
Stress Workshop 2011 | October 12, 2011, 9am - 7pm, Dresden, Germany
http://stress3d.malab.com/index.html
WORKSHOP ON STRESS MANAGEMENT. FOR 3D IC'S USING THROUGH SILICON VIAS. OCTOBER 12, 2011, 9AM - 7PM, DRESDEN, GERMANY. HOSTED BY FRAUNHOFER IZFP, IN COLLABORATION WITH SEMATECH. Download Flyer: stressws2011.pdf. Please feel free to contact Ehrenfried Zschech in case of any questions:. Ehrenfried.zschech@izfp-d.fraunhofer.de. The agenda of the workshop will be published by September 9.
stress.malab.com
stress-workshop 2010
http://stress.malab.com/talks.html
Scope of the Workshop. The workshop will cover the following areas of interest:. Scaling effects for sub-100nm metal structures: grain growth and microstructure. Cu interconnect integration Materials and reliability. Ultra low-k dielectrics: Materials and reliability. 3D integration, TSV and effect on stressed devices. Advanced nanoscale materials and structures. Synchrotron-radiation based and lab-based X-ray techniques for metal characterization. Strain/stress measurements and modeling/simulation.
stress.malab.com
stress-workshop 2010
http://stress.malab.com/index.html
Scope of the Workshop. 11th International Workshop on Stress-Induced Phenomena in Metallization. April 12 - 14, 2010 in Dresden, Germany. Scope of the Workshop.
stress.malab.com
stress-workshop 2010
http://stress.malab.com/scope.html
Scope of the Workshop. Scope of the Workshop. The workshop will provide a forum for presenting current research and for discussions on issues related to stress-induced phenomena in on-chip metal interconnects and solder joints. Stresses arising in metal structures and surrounding dielectric materials due to novel process steps, thermal mismatch of thin film materials, electromigration or microstructure changes can lead to degradation and failure of microelectronic products. Stress-related phenomena exten...
stress.malab.com
stress-workshop 2010
http://stress.malab.com/papercall.html
Scope of the Workshop. Scaling effects for sub-100nm metal structures: grain growth and microstructure. Ultra low-k materials, and diffusion processes as well as electrical and mechanical properties of structures with small dimensions (including CPI). Carbon-based materials and nanostructures (CNT for future interconnects, fullerene-based low-k materials, graphene). 3D integration, TSV and effect on stressed devices. Synchrotron-radiation based techniques (Cu stress, EM/SIV). Scope of the Workshop.
stress.malab.com
stress-workshop 2010
http://stress.malab.com/program.html
Scope of the Workshop. There will be 28 invited talks (all of 35 minutes of duration including discussion), divided into 9 sessions spread over three days. In addition, there will be about 30 posters, constituting a prominent element of the Stress Workshop. These will be displayed throughout the meeting, with a particular poster and BBQ session on Monday night. Three poster prizes (500 Euro, 300 Euro, 200 Euro) will be awarded, on. Download program as high quality pdf file. Last update: April 7, 2010.
stress.malab.com
stress-workshop 2010
http://stress.malab.com/activities.html
Scope of the Workshop. A sightseeing tour which includes the famous Baroque architecture in the downtown and lively suburbs like Dresden Neustadt will be offered for Sunday afternoon (April 11, 2010). If you are interested in a tour, please send an email to ehrenfried.zschech@izfp-d.fraunhofer.de. Scope of the Workshop.
stress3d.malab.com
Stress Workshop 2011 | October 12, 2011, 9am - 7pm, Dresden, Germany
http://stress3d.malab.com/program.html
WORKSHOP ON STRESS MANAGEMENT. FOR 3D IC'S USING THROUGH SILICON VIAS. 09:00 09:15. Welcome (Ehrenfried Zschech, Larry Smith). 09:15 10:15. Summary of Previous Workshops (Mark Nakamoto, Valeriy Sukharev). 10:15 10:45. 3D IC TSV Process and Quality Control. Sesh Ramaswami, Applied Materials, Santa Clara/CA, USA, “Towards process repeatability and robustness in TSV technology”. 10:45 11:15. 11:15 13:00. Experiences From On-chip Interconnect Kinetics and Extension to 3D Stacks. 13:00 14:00.